Heterogeneous Integration with Embedded Fine Interconnect

Abstract

High density heterogeneous integration of ASIC and HBM2 through the use of embedded fine pitch interconnect (EFI) in face-to-face configuration using RDL 1st fan-out wafer packaging platform is demonstrated. The EFI configuration, thermal design consideration and heat dissipation for high power application, mechanical structural modeling for warpage control, wafer fabrication and assembly process integration and reliability testing results will be discussed.