DDSCR Device Structure Fabricated on 0.5 µm CMOS Process

Xiangliang Jin, Yang Wang
{"title":"DDSCR Device Structure Fabricated on 0.5 µm CMOS Process","authors":"Xiangliang Jin, Yang Wang","doi":"10.23919/IEDS48938.2021.9468852","DOIUrl":null,"url":null,"abstract":"Dual Direction Silicon Controlled Rectifier(DDSCR) are primarily used for ESD protection in high voltage environments. According to the results of the device test, the trigger voltage and the sustain voltage of the DDSCR are 17.62V and 9.54V, respectively. Finally, by changing the important dimensions of the DDSCR, the ESD characteristics of the device can be significantly improved.","PeriodicalId":174954,"journal":{"name":"2020 International EOS/ESD Symposium on Design and System (IEDS)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International EOS/ESD Symposium on Design and System (IEDS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/IEDS48938.2021.9468852","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Dual Direction Silicon Controlled Rectifier(DDSCR) are primarily used for ESD protection in high voltage environments. According to the results of the device test, the trigger voltage and the sustain voltage of the DDSCR are 17.62V and 9.54V, respectively. Finally, by changing the important dimensions of the DDSCR, the ESD characteristics of the device can be significantly improved.
基于0.5µm CMOS工艺的DDSCR器件结构
双向可控硅(DDSCR)主要用于高压环境下的ESD保护。器件测试结果显示,DDSCR的触发电压为17.62V,持续电压为9.54V。最后,通过改变DDSCR的重要尺寸,可以显著改善器件的ESD特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信