ELECTRODEPOSITION OF SILVER THIN FILMS ON A GOLD SUBSTRATE IN THE PRESENCE OF OCIMUM GRATISSIMUM (Og) AND VERNONIA AMYGDALINA (Va) PLANT LEAF EXTRACTS.

R. Mfon, Z. A. Amri, A. Sarua
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Abstract

Electrodeposition an advanced thin film deposition method originally used for decorative purposes and now widely used in industrial applications such as electronics, phonics, magnetic recording and protective coatings, has also been used for the production of size and structure-controlled nanoparticles. In this research, the electrodeposition of silver (Ag) films on gold (Au) substrates with two plant (Ocimum gratissimum (Og) and Vernonia amygdalina (Va) leaf extracts as additives was explored . The effect of these leaf extracts immediately after addition and after a prolonged exposure in the electrolyte on the silver deposits was studied using cyclic voltammetry (CV), chronoamperometry (CA) and linear sweep voltammetry (LSV).  Silver thin films were electrodeposited on gold film from an electrolyte of 5 mM AgNO3  and later 5 mM AgNO3 +0.1 M KNO3 for 10 minutes, using a double potential step protocol and potentials -0.15 V and -0.3 V with and without the  plant leaf extracts. As silver was grown on the gold substrate, silver nanoparticles were also discovered to have been formed in the electrolyte. Though the deposition potential in the presence of the plant leaf extracts affected the kinetics of the silver deposition on the gold substrate, it only slightly affected the silver film thickness on the gold.   CV graphs with the plant leaf extracts show lower current densities indicating a slowing down of the deposition/dissolution rates of silver probably due to the adsorption of the leaf extracts on the surface of the growing silver films which may have affected the transport of silver ions (Ag+) towards the electrode and impacted on the silver deposition/dissolution kinetics. The deposited silver film thickness was 7 nm to 8 nm with the Og leaf extract and 1.5 nm to 2 nm with the Va leaf extract. Atomic Force microscope (AFM) was used for viewing the silver films and the mean grain sizes of the Og silver films was calculated to be . This was larger than those of the Va silver films calculated to be While the Va silver films surface roughness was higher at 10.6 , that of the Og silver film was 9.3.
在金衬底上电沉积银薄膜的过程中,有植物叶片提取物的存在。
电沉积是一种先进的薄膜沉积方法,最初用于装饰目的,现在广泛用于工业应用,如电子、语音、磁记录和保护涂层,也用于生产尺寸和结构可控的纳米颗粒。本研究以两种植物(Ocimum gratissimum (Og)和Vernonia amygdalina (Va)叶提取物为添加剂,在金(Au)基底上电沉积银(Ag)薄膜。采用循环伏安法(CV)、计时伏安法(CA)和线性扫描伏安法(LSV)研究了添加后立即和长时间暴露于电解质中的这些叶提取物对银沉积的影响。用5 mM AgNO3和5 mM AgNO3 +0.1 M KNO3的电解液在金膜上电沉积银薄膜,采用双电位步进方案,在-0.15 V和-0.3 V电位下,添加和不添加植物叶提取物,电沉积10分钟。随着银在金衬底上生长,银纳米颗粒也被发现在电解质中形成。虽然植物叶提取物存在时的沉积电位影响了银在金基质上沉积的动力学,但它对金表面银膜厚度的影响很小。植物叶片提取物的CV图显示出较低的电流密度,表明银的沉积/溶解速率减慢,这可能是由于生长的银膜表面吸附了叶子提取物,这可能影响了银离子(Ag+)向电极的运输,并影响了银的沉积/溶解动力学。Og叶提取物的银膜厚度为7 ~ 8 nm, Va叶提取物的银膜厚度为1.5 ~ 2 nm。采用原子力显微镜(AFM)观察银膜,计算出Og银膜的平均晶粒尺寸为。Va银膜的表面粗糙度较高,为10.6,Og银膜的表面粗糙度为9.3。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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