Experiments and models for circuit-level assessment of the reliability of Cu metallization

Abstract

Accurate circuit-level reliability analyses can be based in experimental results for simple interconnect segments if interconnect trees, linked interconnect segments within one level of metallization, are used as fundamental reliability units. The reliability behaviour of both segments and trees is different for Al and Cu. A revised method is proposed for tree-based circuit-level reliability analyses for Cu. The types of additional experimental data that would allow assessments with improves accuracy are outlined.