Understanding Mechanical Integrity of Metal/Ceramic Interfaces Through In-Situ Micro Mechanical Testing and Multiscale Simulations

Xiaoman Zhang, Y. Mu, S. Shao, C. Wick, R. Ramachandran, W. Meng
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Abstract

Mechanical failures of interfacial regions of ceramic-coating/metal-adhesion-layer/substrate systems were measured quantitatively and observed concurrently through instrumented microscale mechanical testing in-situ a scanning electron microscope (SEM). Failure of the interfacial regions of coating/interlayer/substrate systems was observed in micro-pillar specimens in-situ under different loading conditions, including shear, compression, and tension. Under shear loading, shear failure of the interfacial region was observed to occur in two stages: an initial uniform shear plastic deformation of the entire metal interlayer followed by an unstable shear-off close to the metal/ceramic interface. Additional testing under compression loading conditions suggests that the unstable shear-off is concomitant with the metal/ceramic interface going from being “locked”, with no relative displacement between materials on the two sides of the interface, to being “unlocked”, with significant relative displacements. Failure of the interfacial region was also observed under tensile loading conditions. Density functional theory (DFT) and molecular dynamics (MD) studies on one particular metal/ceramic interface, namely Ti/TiN, showed that a weak interaction plane exists in the metal layer near the chemical interface in a coherent Ti/TiN structure. Consequently, the free energy and theoretical shear strength of the semi-coherent Ti/TiN interface is found to depend on the physical location of the misfit dislocation network (MDN). The minimum energy and strength of the interface occur when the MDN is near, but not at the chemical interface. The present work gives new insight into the nature of mechanical failure of metal/ceramic interfaces, is relevant to materials-based engineering of metal/ceramic interfaces, and has applications to engineering of ceramic coating/substrate systems.
通过原位微力学测试和多尺度模拟了解金属/陶瓷界面的力学完整性
采用原位扫描电镜(SEM)对陶瓷-涂层/金属-粘附层/衬底体系界面区域的力学失效进行了定量测量和同步观察。在不同的加载条件下,包括剪切、压缩和拉伸,在原位微柱试样中观察到涂层/层间/衬底体系界面区域的破坏。在剪切载荷作用下,观察到界面区域的剪切破坏发生在两个阶段:整个金属夹层的初始均匀剪切塑性变形,然后是靠近金属/陶瓷界面的不稳定剪切。在压缩载荷条件下的附加测试表明,不稳定剪切是伴随着金属/陶瓷界面从“锁定”状态(界面两侧材料之间没有相对位移)到“解锁”状态(相对位移显著)的过程发生的。在拉伸加载条件下也观察到界面区域的破坏。密度泛函理论(DFT)和分子动力学(MD)研究表明,Ti/TiN结构在化学界面附近的金属层中存在弱相互作用面。因此,发现半相干Ti/TiN界面的自由能和理论剪切强度取决于错配位错网络(MDN)的物理位置。界面的最小能量和强度出现在MDN附近,而不是在化学界面处。本研究对金属/陶瓷界面的机械失效性质有了新的认识,与金属/陶瓷界面的材料工程相关,并可应用于陶瓷涂层/基板系统的工程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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