In-Sn Bumping Design and Fabrication for High Speed Interconnects of Superconducting MCM via Laser Melting/Jetting and Distribution

Abstract

In this paper, we reported a laser melting/jetting bumping technology for flip-chip interconnection, which will provide a flexible interconnection solution for high-speed superconducting MCM (Multi-chip modules). We adopted In-Sn eutectic alloy (with low-melt-point about 117°C) to fabricate flip-chip bump array of SCE-MCM. The effects of the key process parameters (such as laser energy, nitrogen pressure etc.) on interconnection strength were also discussed.