A High Voltage Multi-Purpose On-the-fly Reconfigurable Half-Bridge Gate Driver for GaN HEMTs in 0.18-μm HV SOI CMOS Technology

Nam Ly, N. Aimaier, A. Alameh, Y. Blaquière, G. Cowan, N. Constantin
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引用次数: 4

Abstract

Intended to be the core design of a configurable and flexible high voltage power system for aerospace applications, the gate driver in this work is capable of driving a wide range of GaN devices of different sizes, in half-bridge configuration, with configurable driving strength and dead-time. These features eliminate the need for discrete gate resistors and allow for higher density designs, such as SiP integration. The on-the-fly reconfigurability enables local efficiency optimization and EMI reduction, which is essential in safety-critical applications. The proposed IC was fabricated using XFAB's 0.18 $\mu \mathrm{m}$ HV SOI CMOS process (xt018). Measurement results show that the chip can drive targeted GaN HEMTs from smallest to largest size at the desired turn-on and turn-off speeds, as fast as 1.46/1.18 ns of rise/fall-time. The measured dead-time is from 4.5 ns to 58 ns with an input voltage up to 86 V. The parameters can be reconfigured on-the-fly at a pulse width modulation frequency up to 20 MHz.
基于0.18 μm HV SOI CMOS技术的GaN hemt高电压多用途动态可重构半桥栅极驱动器
本工作中的栅极驱动器旨在成为航空航天应用中可配置和灵活的高压电源系统的核心设计,能够以半桥结构驱动各种不同尺寸的GaN器件,具有可配置的驱动强度和死区时间。这些特性消除了对分立栅极电阻的需求,并允许更高密度的设计,例如SiP集成。动态可重构性可实现局部效率优化和EMI降低,这在安全关键应用中至关重要。该集成电路采用XFAB的0.18 $\mu \ mathm {m}$ HV SOI CMOS工艺(xt018)制造。测量结果表明,该芯片能够以所需的通断速度驱动目标GaN hemt从最小尺寸到最大尺寸,上升/下降时间高达1.46/1.18 ns。在输入电压高达86 V的情况下,测量到的死区时间为4.5 ~ 58ns。这些参数可以在高达20mhz的脉宽调制频率下实时重新配置。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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