The sandblasting use prospects in the semiconductor diodes production

Abstract

The process of manufacturing semiconductor components for the production of microwave diodes is considered. Scientifically based recommendations are presented for the separation of relatively thick, up to 1.5 mm, stacked silicon-based semiconductor substrates by the so-called sandblasting method, based on masking and pneumatic jet cutting of the substrate with micro abrasive powder. It is described the masking method and the principals of setting of the operating parameters of the packaged substrate jet processing, which were tested with a positive result on a pilot industrial sandblasting plant currently used by a domestic enterprise.