Thick Film Integrated Circuit Design of Multi-measurement Module

Abstract

This paper introduces a kind of Thick film integrated circuit design of multi-measurement module [1]. The thick film integrated circuit improves many inadequacies of traditional single signal collecting system, like various spices, poor generality, inconvenient debug and maintenance etc. It realizes the measurement of various signals like voltage, current, thermocouple, resistance, frequency etc, and the measuring accuracy is up to 0.2%-0.3%. As a component, the integrated circuit is applied to front-end design of the instrument. It can guarantee high reliability, high accuracy and high level of integration of the system front-end design. So it can solve the problems of traditional design, like heavy workload, long development cycle etc.