Hang Lan, Yan Luo, Qi Qiao, Guodong Song, Jing Wang, Wei Shen
{"title":"Design of X-band 4-channel T/R module with High power and High efficiency","authors":"Hang Lan, Yan Luo, Qi Qiao, Guodong Song, Jing Wang, Wei Shen","doi":"10.1109/CISS57580.2022.9971259","DOIUrl":null,"url":null,"abstract":"This paper proposed a high power and high efficiency 4-channnel T/R module for X-band. The output power is greater than 44.7dBm with the efficiency greater than 42%. The stability of the module is ensured by effective heat dissipation. The consistency among channels is better than ± 0.3 dB. The vertical interconnection technology of microstripstripline is adopted to reduce interference. The metal wall inside the module effectively prevents self-oscillation caused by excessive gain and increases the isolation of Tx-Rx, and the other channels. Miniaturization and high interation of RF channels are achieved by using the multifunctional monolithic microwave integrated circuit (MMIC) chip technology. The weight of the whole module is less than 100g with the size within 65mm*57.8mm*8mm.","PeriodicalId":331510,"journal":{"name":"2022 3rd China International SAR Symposium (CISS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 3rd China International SAR Symposium (CISS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CISS57580.2022.9971259","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper proposed a high power and high efficiency 4-channnel T/R module for X-band. The output power is greater than 44.7dBm with the efficiency greater than 42%. The stability of the module is ensured by effective heat dissipation. The consistency among channels is better than ± 0.3 dB. The vertical interconnection technology of microstripstripline is adopted to reduce interference. The metal wall inside the module effectively prevents self-oscillation caused by excessive gain and increases the isolation of Tx-Rx, and the other channels. Miniaturization and high interation of RF channels are achieved by using the multifunctional monolithic microwave integrated circuit (MMIC) chip technology. The weight of the whole module is less than 100g with the size within 65mm*57.8mm*8mm.