Defects and Resistance Degradation of Sputtered Doped Lead Zirconate Titanate Thin Films

K. Ho, D. Reis, K. Hiller
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Abstract

The resistance degradation of sputtered doped lead zirconate titanate thin film resulting from the lowering of the Schottky barrier height was identified by current-voltage characterization over degradation. In addition to migration of oxygen vacancies, potential hole trapping of lead vacancies was observed by Thermally Stimulated Depolarization Current measurements. Both defects were proposed to increase the effective positive space charge density near the interface depletion region along degradation and be responsible for the resulting resistance degradation. This manifestation of defects in the resistance degradation was found to be separated in degradation time and dependent on the wafer position.
溅射掺杂锆钛酸铅薄膜的缺陷及电阻退化
通过电流-电压表征,确定了溅射掺杂锆钛酸铅薄膜由于肖特基势垒高度降低而导致的电阻退化。除了氧空位的迁移外,热激退极化电流测量还观察到铅空位的电位空穴捕获。这两种缺陷都增加了界面耗尽区附近的有效空间正电荷密度,并导致了电阻的下降。发现这种电阻退化缺陷的表现在降解时间上是分离的,并且依赖于晶圆位置。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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