Single Event Burnout Sensitivity Prediction Based on Commercial MOSFET Electrical Characteristics Analysis

Abstract

Power MOSFET transistors are the main part of the power supply system for any equipment, including spacecraft. Modern vertical MOSFETs are designed as regular matrix structures of elementary parallel cells (mini-transistors), made according to submicron process. Single event burnout (SEB) of a vertical cell is the main mechanism for failure of vertical MOSFETs from single particle effect. In addition to SEB, there are several other reasons for the MOSFET burnout, caused by extremal bias, that are tested during manufacturing. The MOSFETs SEB sensitivity prediction model is presented. The model is based on the analysis of burnout bias characteristics from the datasheets. The comparison of experimental data and model prediction results is presented in the article. The figure of merit (FOM) for SEB sensitivity prediction is proposed. The optimal value of FOM for n-MOSFETs and LET 40 MeV cm2/mg is presented. So, the model helps to determine the most sensitive MOSFET transistors before expensive testing done.