Carrier depletion and grain misorientations on individual grain boundaries of polycrystalline Si thin films

C. Jiang, H. Moutinho, F. Liu, M. Romero, M. Al‐Jassim
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引用次数: 2

Abstract

Structural and microelectrical properties of grain boundaries (GBs) in polycrystalline Si thin films were investigated by electron backscattering diffraction (EBSD) and scanning capacitance microscopy (SCM). The SCM measurements revealed highly nonuniform carrier depletions among the GBs, indicating the variety of electrical properties due to the specific GB structures. The EBSD measurement showed that the films are weakly [001]-oriented with small fractions of grains in the [111] and [110] orientations. Comparison of the SCM and EBSD measurements taken on the same film area led to the following observations: (1) Σ3 GBs do not exhibit carrier depletions and thus do not have charged deep levels; (2) Some Σ9 GBs exhibit carrier depletions and some do not, indicating that the intrinsic ਺9 GBs do not have charged deep levels and the carrier depletions are due to impurity gettering at the GBs; (3) No significant relationship between the carrier depletion behavior and the grain misorientation was found so far on the GBs with random misorientations; (4) The carrier depletion behavior does not depend only on the grain misorientation but also on the facet where the GB is taken.
多晶硅薄膜中载流子损耗和晶粒取向偏斜
采用电子背散射衍射(EBSD)和扫描电容显微镜(SCM)研究了多晶硅薄膜的晶界结构和微电性能。单片机测量揭示了GB之间高度不均匀的载流子损耗,表明由于特定的GB结构而导致的电性能的变化。EBSD测量表明,薄膜具有弱[001]取向,[111]和[110]取向中有少量晶粒。比较SCM和EBSD在同一膜面积上的测量结果得出以下结论:(1)Σ3 gb不表现出载流子耗尽,因此不具有充电深度;(2)一些Σ9 gb表现出载流子耗尽,而一些则没有,这表明本征਺9gb不具有带电深能级,载流子耗尽是由于在GBs处杂质的吸收;(3)在随机取向取向的GBs上,载流子损耗行为与晶粒错取向之间没有显著的关系;(4)载流子损耗行为不仅与晶粒取向偏差有关,还与取GB的面有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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