Study on 532nm and CO2 laser processing of fused silica glass

Abstract

The fused silica glass is widely used in the photoelectricity and semiconductor industry, and needed to be cut or made small holes and micro grooves on it. Recent reports indicate that laser processing is one of important means for fused silica glass. First of all, the laser processing characteristics of fused silica glass was discussed in this paper. Besides, 532nm wavelength and CO2 laser were used to process or cut fused silica glass, and different results were found. 532nm laser is more suitable for processing holes and micro grooves on thin fused silica glass. Then CO2 laser can be used to cut thick fused silica plate or marked on the glass surface. In addition, the two laser machined surface was observed with 3D microscope, and it displays huge surface differences. The first one is rough, and another is smooth.