The Optimal Solution of Reflow Oven Recipe based on Physics-guided Machine Learning Model

Yangyang Lai, K. Pan, J. Ha, Chongyang Cai, Junbo Yang, Pengcheng Yin, Jiefeng Xu, Seungbae Park
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引用次数: 8

Abstract

This paper presents a physics-guided machine learning model to provide the optimal reflow recipe for a 7-zone oven. The numerical method based on the computational fluid dynamics (CFD) simulation was used to predict reflow profiles of a BGA package. After validating the CFD model with the measurement results, an automated system was programmed to collect profiles subjected to 81 sets of boundary conditions (reflow recipe). A machine learning model trained by 81 sets of input data was employed to predict profiles subjected to 148,176 sets boundary conditions rapidly. The peak temperature and time above liquidous of output profiles were extracted to quantify the performance of the corresponding boundary conditions. The boundary condition with the best reflow performance was regarded as the optimal recipe.
基于物理引导机器学习模型的回流炉配方最优解
本文提出了一个物理指导的机器学习模型,为七区烤箱提供最佳回流配方。采用基于计算流体力学(CFD)模拟的数值方法对BGA封装的回流曲线进行了预测。在将CFD模型与测量结果进行验证后,对一个自动化系统进行编程,以收集81组边界条件(回流配方)下的剖面。利用81组输入数据训练的机器学习模型,快速预测了148,176组边界条件下的轮廓。提取了输出剖面的峰值温度和峰值时间,量化了相应边界条件的性能。以回流性能最佳的边界条件作为最优配方。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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