The Reconfigurable Flip Chip Assembly System

Abstract

The electronic industry developed and expanded explosively. By increasingly using flip chip (FC) packaging technology, the boundary between three levels of packaging of micro-electronic systems became indistinct. The trend towards portable and hand-held devices also enlarges the market share of FC packaging, which is the major packaging technology. Rapidly changing micro-electronic market calls for reconfigurable micro-electronic assembly systems with product variability, responsiveness, non-obsolescence, and cost-effectiveness. The introduction of FC technology and reconfigurability of assembly system are discussed in this paper, and a reconfigurable FC assembly system is presented