Model extractions of coupled bonding-wire structures in electronic packaging

Abstract

An extracted model of coupled bonding wires is presented. The discontinuity caused by the bonding wires would significantly affect the high-speed performance of the whole system as the speed of signal propagation is increasing. The bonding wire structures with regards to the vertical and parallel coupling schemes are analyzed in this paper while their middle interconnections are represented as the cascade network of uniform transmission-line sections. Finally, the validation is implemented by using the established models and measurements to verify the presented analysis methods.