Intellectual Property Protection in Additive Layer Manufacturing: Requirements for Secure Outsourcing

M. Yampolskiy, T. Andel, J. McDonald, W. Glisson, Alec Yasinsac
{"title":"Intellectual Property Protection in Additive Layer Manufacturing: Requirements for Secure Outsourcing","authors":"M. Yampolskiy, T. Andel, J. McDonald, W. Glisson, Alec Yasinsac","doi":"10.1145/2689702.2689709","DOIUrl":null,"url":null,"abstract":"Additive Layer Manufacturing (ALM) is a new technology to produce 3D objects adding layer by layer. Agencies and companies like NASA, ESA, and SpaceX are exploring a broad range of application areas of ALM, which includes printing of device components, replacement parts, houses, and even food. They expect that this technology will greatly reduce production costs, manufacturing time, and necessary storage space. The broad variety of application areas and the high grade of computerization of this manufacturing process will inevitably make ALM an attractive target of various attacks. This research examines the problem of Intellectual Property (IP) protection in the case of outsourcing the ALM manufacturing process. We discuss the existing process and introduce a new model for the outsourcing of ALM-based production. For the proposed outsourcing model, focusing on IP protection, we present a risk assessment, specify requirements addressing mitigation of the identified risks, and outline approaches to implement the specified requirements. The fulfillment of the specified requirements will enable secure outsourcing of ALM production.","PeriodicalId":308663,"journal":{"name":"Proceedings of the 4th Program Protection and Reverse Engineering Workshop","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"75","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 4th Program Protection and Reverse Engineering Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2689702.2689709","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 75

Abstract

Additive Layer Manufacturing (ALM) is a new technology to produce 3D objects adding layer by layer. Agencies and companies like NASA, ESA, and SpaceX are exploring a broad range of application areas of ALM, which includes printing of device components, replacement parts, houses, and even food. They expect that this technology will greatly reduce production costs, manufacturing time, and necessary storage space. The broad variety of application areas and the high grade of computerization of this manufacturing process will inevitably make ALM an attractive target of various attacks. This research examines the problem of Intellectual Property (IP) protection in the case of outsourcing the ALM manufacturing process. We discuss the existing process and introduce a new model for the outsourcing of ALM-based production. For the proposed outsourcing model, focusing on IP protection, we present a risk assessment, specify requirements addressing mitigation of the identified risks, and outline approaches to implement the specified requirements. The fulfillment of the specified requirements will enable secure outsourcing of ALM production.
增材制造中的知识产权保护:安全外包的要求
增材层制造(Additive Layer Manufacturing, ALM)是一种逐层叠加制造三维物体的新技术。NASA、ESA和SpaceX等机构和公司正在探索ALM的广泛应用领域,包括设备部件、替换部件、房屋甚至食品的打印。他们期望这项技术将大大降低生产成本、制造时间和必要的存储空间。这种制造过程的广泛应用领域和高度的计算机化将不可避免地使ALM成为各种攻击的诱人目标。本研究探讨了在ALM制造过程外包的情况下,知识产权(IP)保护问题。我们讨论了现有的流程,并介绍了一种新的基于alm的生产外包模型。对于以知识产权保护为重点的拟议外包模式,我们提出了一项风险评估,具体说明了减轻已识别风险的要求,并概述了实现指定要求的方法。指定需求的实现将使ALM生产的安全外包成为可能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信