2.3 A 130-to-180GHz 0.0035mm2 SPDT switch with 3.3dB loss and 23.7dB isolation in 65nm bulk CMOS

F. Meng, Kaixue Ma, K. Yeo
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引用次数: 21

Abstract

Single-pole double-throw (SPDT) switches are a key building block for enabling transceiver time-division duplexing (TDD) when operated as a T/R switch or for eliminating imager fluctuations when operated as a Dicke switch. To provide acceptable compromises of IMF, Pout and sensitivity in transceivers or imagers, the switches are required to feature an insertion loss of ~3dB and an isolation of ~20dB. Recently, mm-Wave/sub-mm-Wave transceiver and imager integrated circuits have gradually migrated to silicon platforms for low-cost consumer markets [1,2]. However, the associated SPDT switches operating beyond 110GHz are developed using advanced SOI or SiGe HBT technologies [3,4] and rarely implemented in CMOS due to the lossy substrate and poor transistor characteristics [2,5].
2.3一种130- 180ghz 0.0035mm2 SPDT开关,损耗3.3dB,隔离度23.7dB,采用65nm块体CMOS
单极双掷(SPDT)开关是收发器时分双工(TDD)作为收发开关或消除成像器波动作为迪克开关时的关键组成部分。为了在收发器或成像仪中提供可接受的IMF, Pout和灵敏度折衷,开关需要具有~3dB的插入损耗和~20dB的隔离。最近,毫米波/亚毫米波收发器和成像仪集成电路逐渐迁移到低成本消费市场的硅平台上[1,2]。然而,相关的工作频率超过110GHz的SPDT开关是使用先进的SOI或SiGe HBT技术开发的[3,4],由于衬底损耗和晶体管特性差,很少在CMOS中实现[2,5]。
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