Modelling methodologies for assessment of 3D inkjet-printed electronics

Abstract

3D printing technologies provide one of the most efficient methods for product design, prototyping and manufacture in a cost-effective, high-throughput, mass-customisation and energy efficient manner. One growing application of 3D printing includes the fabrication, packaging and integration of electronic structures and components. This paper presents modelling methodologies and toolsets that can be used to address some of the present design-for-reliability challenges related to 3D inkjet-printed electronics. The use of advanced capabilities in finite element modelling is proposed and employed in order to predict the mechanical behaviour of cured ink-based materials when deposited sequentially layer-by-layer. Such build-up approach can lead to structural weakness and dimensional inaccuracy in the third dimension due to cure shrinkage. In addition, effects of different process and material parameters on the stress induced in silver ink printed conductive lines under thermal load are analysed. This analysis uses integrated finite element based design-of-simulations approach and response surface modelling. The geometric design of the investigated printed structure are found to be less influential compared with the mechanical properties of the cured insulating material and the magnitude of the temperature load to which the structure is exposed.