Overview of Au-Al Bond Interface

Abstract

Wire bonding technology is the main form of interconnection in integrated circuits. It has the advantages of simple process, low cost, and suitable for various packaging forms. In traditional integrated circuits, gold wires are used to achieve electrical interconnection between the chip and the housing for reliability considerations. According to related documents and patents, this literature overviews the research progress of the influence of bonding materials, bonding pad quality and interface compound evolution on the interface bonding strength and reliability, and looks forward to the future development prospects. The article reviews bonding wires and the development direction of bonding alloy wires. The paper summarizes the theory of void growth on the bonding interface, that is kirkendall effect, volume shrinkage and IMC oxidation. The article studies the influence of alloy wires on the quality of the bonding interface, as well as the effects of doping with different components and gold content.