An improved characterization method for the dielectric properties of RFIC encapsulating plastics

Abstract

A new method has been developed to measure the relative dielectric constant and loss tangent of encapsulating plastic typically used in RFIC package applications. Measured resonances in a rectangular cavity are electromagnetically simulated to obtain the electronic properties of a dielectric material. The advantage of this method is that expensive fixturing is not required, and the electronic properties at any resonance frequency can be obtained.