{"title":"VHDL-AMS Thermo-Mechanical Model for Coupled Analysis of Power Module Degradation in Circuit Simulation Environments","authors":"O. Olanrewaju, A. Castellazzi","doi":"10.1109/SISPAD.2018.8551708","DOIUrl":null,"url":null,"abstract":"This work proposes the development of a simplified thermo-mechanical model suitable for coupling with device physics and a 3D electrothermal model in line with the creation of a comprehensive framework for circuit simulation of multidomain problems. Commercially available numerical analysis software are capable of showing thermo-mechanical effects but lack real-time feedback between domains and require sophisticated CAD/meshing. Here, we show a ID mechanical model coupled to a thermal model which is capable of generating accurate mechanical Strain and stress values of a power assembly while optimizing the tradeoff with computational efficiency. The thermo-mechanical model was created in VHDL-AMS language because of the multi-domain capability of VHDL-AMS.","PeriodicalId":170070,"journal":{"name":"2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2018.8551708","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This work proposes the development of a simplified thermo-mechanical model suitable for coupling with device physics and a 3D electrothermal model in line with the creation of a comprehensive framework for circuit simulation of multidomain problems. Commercially available numerical analysis software are capable of showing thermo-mechanical effects but lack real-time feedback between domains and require sophisticated CAD/meshing. Here, we show a ID mechanical model coupled to a thermal model which is capable of generating accurate mechanical Strain and stress values of a power assembly while optimizing the tradeoff with computational efficiency. The thermo-mechanical model was created in VHDL-AMS language because of the multi-domain capability of VHDL-AMS.