VHDL-AMS Thermo-Mechanical Model for Coupled Analysis of Power Module Degradation in Circuit Simulation Environments

O. Olanrewaju, A. Castellazzi
{"title":"VHDL-AMS Thermo-Mechanical Model for Coupled Analysis of Power Module Degradation in Circuit Simulation Environments","authors":"O. Olanrewaju, A. Castellazzi","doi":"10.1109/SISPAD.2018.8551708","DOIUrl":null,"url":null,"abstract":"This work proposes the development of a simplified thermo-mechanical model suitable for coupling with device physics and a 3D electrothermal model in line with the creation of a comprehensive framework for circuit simulation of multidomain problems. Commercially available numerical analysis software are capable of showing thermo-mechanical effects but lack real-time feedback between domains and require sophisticated CAD/meshing. Here, we show a ID mechanical model coupled to a thermal model which is capable of generating accurate mechanical Strain and stress values of a power assembly while optimizing the tradeoff with computational efficiency. The thermo-mechanical model was created in VHDL-AMS language because of the multi-domain capability of VHDL-AMS.","PeriodicalId":170070,"journal":{"name":"2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2018.8551708","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

This work proposes the development of a simplified thermo-mechanical model suitable for coupling with device physics and a 3D electrothermal model in line with the creation of a comprehensive framework for circuit simulation of multidomain problems. Commercially available numerical analysis software are capable of showing thermo-mechanical effects but lack real-time feedback between domains and require sophisticated CAD/meshing. Here, we show a ID mechanical model coupled to a thermal model which is capable of generating accurate mechanical Strain and stress values of a power assembly while optimizing the tradeoff with computational efficiency. The thermo-mechanical model was created in VHDL-AMS language because of the multi-domain capability of VHDL-AMS.
电路仿真环境下功率模块退化耦合分析的VHDL-AMS热-力学模型
这项工作提出了一种简化的热-机械模型的发展,适合与器件物理耦合,并建立了一个3D电热模型,以建立一个综合框架,用于多域问题的电路仿真。商业上可用的数值分析软件能够显示热力学效应,但缺乏域之间的实时反馈,并且需要复杂的CAD/网格划分。在这里,我们展示了一个耦合到热模型的ID力学模型,该模型能够生成准确的动力组件的机械应变和应力值,同时优化计算效率的权衡。利用VHDL-AMS的多域特性,采用VHDL-AMS语言建立热力学模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信