Power agnostic technique for efficient temperature estimation of multicore embedded systems

Devendra Rai, Hoeseok Yang, Iuliana Bacivarov, L. Thiele
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引用次数: 21

Abstract

Temperature plays an increasingly important role in the overall performance and reliability of a computing system. Multi- and many-core systems provide an opportunity to manage the overall temperature profile by cleverly designing the application-to-core mapping and the associated scheduling policies. An uncontrolled temperature profile may lead to an unplanned performance loss, since the system activates protective mechanisms such as voltage and/or frequency scaling to cool itself. Similarly, deep thermal cycles with high frequency lead to severe deterioration in the overall reliability of the system. Design space exploration tools are often used to optimize binding and scheduling choices based on a given set of constraints and objectives, thus motivating the need for fast and accurate temperature estimation techniques. We argue that the currently available techniques are not an ideal fit to design space exploration tools, and suggest a system level technique which is based on application fingerprinting. It does not need any information about the processor floorplan, the physical and thermal structure, or about power consumption. Instead, its temperature estimation is based on a set of application-specific calibration runs and associated temperature measurements using available built-in sensors. We show that a given application possesses a unique thermal signature on the system it executes on, which provides a computationally fast method to calculate accurate temperature traces. Extensive experimental studies show that our technique can estimate temperature on all cores of a system to within $5^{o}C$, and is three orders of magnitude faster than state of the art numerical simulators like \emph{Hotspot.}
多核嵌入式系统有效温度估计的功率不可知技术
温度对计算系统的整体性能和可靠性起着越来越重要的作用。通过巧妙地设计应用程序到核心的映射和相关的调度策略,多核和多核系统提供了管理整体温度概况的机会。由于系统会激活保护机制(如电压和/或频率缩放)来自我冷却,因此不受控制的温度曲线可能会导致意外的性能损失。同样,高频率的深度热循环会导致系统整体可靠性的严重恶化。设计空间探索工具通常用于基于给定的约束和目标集来优化绑定和调度选择,从而激发对快速和准确的温度估计技术的需求。我们认为,目前可用的技术并不适合设计空间探索工具,并建议基于应用指纹的系统级技术。它不需要任何有关处理器平面图、物理和热结构或功耗的信息。相反,它的温度估计是基于一组特定应用的校准运行和使用可用的内置传感器的相关温度测量。我们表明,给定的应用程序在其执行的系统上具有独特的热特征,这提供了一种计算快速的方法来计算精确的温度迹线。大量的实验研究表明,我们的技术可以在$5^{o}C$内估计系统所有核心的温度,并且比最先进的数值模拟器(如\emph{Hotspot)快三个数量级。}
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