Benefits of heat-assist for laser annealing

Extended Abstracts of the Fifth International Workshop on Junction Technology Pub Date : 2005-06-07 DOI:10.1109/IWJT.2005.203880

K. Shibahara

引用次数: 1

Abstract

In this paper, a new scheme for laser annealing named partial-melt laser annealing (PMLA) is proposed based on the knowledges obtained with heat-assisted laser annealing (HALA) investigation. Its feasibility for 10 nm junction was demonstrated. The obtained sheet resistance indicated sufficient dopant activation by this method.

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热辅助激光退火的优点

本文在热辅助激光退火(HALA)研究的基础上，提出了一种新的激光退火方案——部分熔体激光退火(PMLA)。证明了其在10nm结上的可行性。通过该方法得到的薄片电阻表明掺杂剂有充分的活化作用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Extended Abstracts of the Fifth International Workshop on Junction Technology

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