{"title":"64/spl times/64 matrix-addressable arrays of GaN-based microLEDs","authors":"C. Jeon, H. Choi, P. Edwards, A. Bryce, M. Dawson","doi":"10.1109/LEOS.2002.1159491","DOIUrl":null,"url":null,"abstract":"The fabrication and performance of GaN-based micro-light emitting diode (g-LED) arrays with 64/spl times/64 elements is reported. The diameter of each element is 20 /spl mu/m and center-to-center spacing of 30 /spl mu/m, giving an overall active area of the arrays of 80425 /spl mu/m/sup 2/. With the introduction of a matrix addressing scheme, the number of bond pads has been reduced from n/sup 2/ to 2n, facilitating the packaging of the devices. The arrays emit >50 /spl mu/W per element at 3mA drive current. The advances in fabrication and performance reported in this work bring these arrays to the threshold of advanced research and commercial applications in areas of micro-displays, sensing, biophotonics and data-communications.","PeriodicalId":423869,"journal":{"name":"The 15th Annual Meeting of the IEEE Lasers and Electro-Optics Society","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 15th Annual Meeting of the IEEE Lasers and Electro-Optics Society","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOS.2002.1159491","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The fabrication and performance of GaN-based micro-light emitting diode (g-LED) arrays with 64/spl times/64 elements is reported. The diameter of each element is 20 /spl mu/m and center-to-center spacing of 30 /spl mu/m, giving an overall active area of the arrays of 80425 /spl mu/m/sup 2/. With the introduction of a matrix addressing scheme, the number of bond pads has been reduced from n/sup 2/ to 2n, facilitating the packaging of the devices. The arrays emit >50 /spl mu/W per element at 3mA drive current. The advances in fabrication and performance reported in this work bring these arrays to the threshold of advanced research and commercial applications in areas of micro-displays, sensing, biophotonics and data-communications.