Ceramic packaging technologies for microwave applications

Abstract

Laminated ceramic packaging technologies, such as high temperature cofired ceramics (HTCC) and low temperature cofired ceramics (LTCC), are a low-cost alternative for metallic packages in high reliability applications in the microwave frequency region. As in metallic packages the main concern-from an electrical performance point of view-is the resonances in cavities; in ceramic packages isolation also has to be considered. Typically good isolation has been accomplished with the use of vias in strategic regions, such as around chip cavities and between neighbouring signal lines. In this paper, the key features of laminated ceramic packaging technologies are presented with some 3-D electromagnetic simulation results concerning isolation.