Influence of Pressure on TCR of Polysilicon Piezoresistive Sensor

Samridhi, Kulwant Singh, P. A. Alvi
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引用次数: 1

Abstract

Temperature based pressure sensor is much needed to be used in hot environment but many of the electronic devices have little tolerance for heat. However, high temperature transducers can be a best solution for compensating heat problem on the performance of sensor. In this paper, two different design modelling has been taken into consideration: the first one is membrane and another one is diaphragm. The effect of temperature on the sensitivity of both the pressure sensor has been optimized through finite element analysis. Both the sensors have been subjected to external pressure ranges from 10 to 40 psi. The sensitivity is found to be ~0.526mv/psi in case of membrane; while in case of diaphragm, it is ~1.00mv/psi. The change in resistance for membrane varies linearly with respect to temperature and pressure; while change in resistance is altered in case of diaphragm. The TCR value of diaphragm and membrane was found to be ~5.76×10−3 (ºC)−land ~4.46×10−3 (ºC)−1.
压力对多晶硅压阻式传感器TCR的影响
基于温度的压力传感器在高温环境中得到了广泛的应用,但许多电子设备的耐热性差。而高温传感器是解决传感器性能热补偿问题的最佳方法。本文考虑了两种不同的设计模型:一种是膜结构,另一种是隔膜结构。通过有限元分析,优化了温度对两种压力传感器灵敏度的影响。这两个传感器都承受了10到40 psi的外部压力。膜的灵敏度为~0.526mv/psi;而对于隔膜,它是~1.00mv/psi。膜的电阻变化随温度和压力呈线性变化;而在隔膜的情况下,电阻的变化是改变的。膜片和膜的TCR值为~5.76×10−3(ºC)−陆地~4.46×10−3(ºC)−1。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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