RF Noise Shielding Method and Modelling for Nanoscale MOSFET

J. Guo, Yi-Min Lin, Y. Tsai
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引用次数: 1

Abstract

RF noise shielding methods with different coverage areas (Pad and TML shielding) were implemented in two port test structures adopting 100-nm MOSFETs. Noise measurement reveals an effective suppression of NFmin but increase of NF50, simultaneously from the shielding methods. The suppression of NFmin is contributed from the reduction of Re(Yopt) while the noise resistance Rn is kept nearly the same. A lossy substrate model developed in our original work for a standard structure without shielding can be easily extended based on the layout and topology of the shielding schemes to predict the noise shielding effect and explain the mechanisms. The extended lossy substrate model indicates that the elimination of substrate loss represented by substrate RLC networks is the major mechanism contributing the reduction of NFmin. However, the increase of parasitic capacitance generated from the shielding structures is responsible for the degradation of fT and NF50. The results provide an important insight and guideline for low noise RF circuit design.
纳米MOSFET射频噪声屏蔽方法及建模
在两个采用100 nm mosfet的端口测试结构中实现了不同覆盖面积(Pad和TML屏蔽)的射频噪声屏蔽方法。噪声测量表明,屏蔽方法有效地抑制了NFmin,但增加了NF50。NFmin的抑制是由于降低了Re(Yopt),而抗噪声Rn几乎保持不变。我们在原始工作中建立的无屏蔽标准结构的有损衬底模型可以很容易地根据屏蔽方案的布局和拓扑进行扩展,以预测噪声屏蔽效果并解释其机制。扩展的损耗底物模型表明,以底物RLC网络为代表的底物损耗消除是减少NFmin的主要机制。然而,屏蔽结构产生的寄生电容的增加是导致fT和NF50退化的原因。研究结果对低噪声射频电路的设计具有重要的指导意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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