Direct Power Board Bonding Technology for 3D Power Module Package

Abstract

Power module is used in a wide range of fields such as, home appliance, industry, railway, automobile, renewal energy, and so on. Recently, it is increasing to be required miniaturization of footprint and higher reliability to power modules. This paper introduces the new package technology has the Power board (thicker copper printed circuit board) as inner connection instead of the conventional wire connection. This technology leads further downsizing, lower package stray inductance, and robustness to answer the market requirements.