Confinement Effect and Conduction Band Offset in DG-SOI MOSFETs: A Simulation Study

Harshit Kansal, Nalin Vilochan Mishra, A. Medury
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Abstract

Besides Quantum Confinement Effects (QCEs) seen in Ultra-Thin (UT) channel Double-Gate Silicon on Insulator (DG-SOI) MOS devices, the Band-offset variations between the oxide and the UT channel also impact device electrostatics, which is not adequately considered by the existing TCAD Models. Effective Mass Approximation (EMA) is one of the widely used approach which takes both QCEs and Conduction Band offset (CBO) variations into account. In this work, we ensure the accuracy of the EMA approach through benchmarking the results with the Tight-Binding Method (TBM), for an infinite potential well (equivalent to considering high CBO) case. Having corrected effective mass while also inserting suitable energy correction parameters, the accuracy of the EMA approach is now ensured. In this work, we show that by reducing the band-gap of the oxide material, the integrated charge density obtained using the Direct Tunneling (DT) model in TCAD can now accurately emulate the results obtained from the benchmarked Effective Mass Approximation (EMA) approach.
DG-SOI mosfet中的约束效应和导带偏移:仿真研究
除了在超薄(UT)通道双栅绝缘体硅(DG-SOI) MOS器件中看到的量子约束效应(QCEs)外,氧化物和UT通道之间的带偏变化也会影响器件的静电,而现有的TCAD模型没有充分考虑到这一点。有效质量近似(EMA)是一种广泛使用的方法,它同时考虑了qce和传导带偏移(CBO)的变化。在这项工作中,我们通过使用紧密结合方法(TBM)对无限电位井(相当于考虑高CBO)的结果进行基准测试来确保EMA方法的准确性。在校正了有效质量的同时,还插入了合适的能量校正参数,现在确保了EMA方法的准确性。在这项工作中,我们表明,通过减少氧化物材料的带隙,使用TCAD中的直接隧道(DT)模型获得的集成电荷密度现在可以准确地模拟基准有效质量近似(EMA)方法获得的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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