Modeling and characterization of wire bonding and tape automatic bonding. Analytical formulas and experimental validation

Proceedings RAWCON 98. 1998 IEEE Radio and Wireless Conference (Cat. No.98EX194) Pub Date : 1998-08-09 DOI:10.1109/RAWCON.1998.709191

N. Hassaine, Y. Shen, P. Ntake

引用次数: 1

Abstract

A simplified method has been established to model and characterize two types of short interconnections: wire bonding and tape automatic bonding (TAB). A comparison between these two parasitic elements is presented and analytical formulas easy to use in CAD applications are proposed to calculate their inductance. These results are compared with measurements performed in the frequency range of (1-30) GHz.

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线键合和胶带自动键合的建模和表征。分析公式及实验验证

建立了一种简化的方法来模拟和表征两种类型的短互连:线连接和胶带自动连接(TAB)。对这两种寄生元件进行了比较，并提出了易于在CAD应用中计算其电感的解析公式。这些结果与(1-30)GHz频率范围内的测量结果进行了比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings RAWCON 98. 1998 IEEE Radio and Wireless Conference (Cat. No.98EX194)

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