Extraction of the trap density at the gate periphery using the gated diode array for giga-bit DRAMs

H. Suzuki, M. Kojima, Y. Nara
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引用次数: 2

Abstract

Gated diode arrays which have varied peripheral length around the gates are proposed to evaluate the leakage current at the gate periphery of deep sub-micron devices. Due to the high electric field at the gate edge in deep sub-micron devices, the leakage current is enhanced by trap-assisted tunneling. The leakage currents at the gate edge were measured independently of the junction bias voltage with the gated diode arrays. This allows extraction of the trap density at the gate edge, even for deep sub-micron devices with high doping concentration. This method is useful for extraction of the trap density at the gate edge, which is the key parameter for control of the junction leakage current, for deep sub-micron devices in giga-bit DRAM.
利用门控二极管阵列提取千兆位dram栅极外围的陷阱密度
在深亚微米器件的栅极周围,提出了具有不同外围长度的门控二极管阵列,用于测量栅极周围的泄漏电流。在深亚微米器件中,由于栅极边缘处的高电场,陷阱辅助隧穿可以增强漏电流。用门控二极管阵列测量了与结偏置电压无关的栅边漏电流。这允许在栅极边缘提取陷阱密度,甚至对于具有高掺杂浓度的深亚微米器件。该方法可用于提取深亚微米器件的栅极边缘陷阱密度,这是控制结漏电流的关键参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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