Evaluation of near-singular integrals for quadrilateral basis in integral equation solver

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2016-12-01 DOI:10.1109/EDAPS.2016.7874405

C. Luo, Giacomo Bianconi, Swagato Chakraborty

引用次数: 0

Abstract

The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.

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积分方程求解器中四边形基近奇异积分的求值

本文提出了一种利用四边形基函数对集成电路封装和印刷电路板中互连结构的三维边界元全波分析求近奇异格林函数积分的有效而准确的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

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