Heat Transfer Modeling of Nanoparticle Packings on a Substrate

Abstract

The temperature evolution of nanoparticle packings on a substrate under high laser power is investigated both experimentally and via numerical simulations. Numerical modeling of temperature distributions in copper nanoparticle packings on a glass substrate is performed and results are compared with experiment under 2.6 kW/cm2 laser power. A coupled electromagnetic-heat transfer model is implemented to understand the nanoparticle temperature distribution. Very good agreement between the coupled electromagnetic-heat transfer model and the experimental results is obtained by matching the interfacial thermal conductance, G, between the nanoparticles using the experimental result in the coupled electromagnetic-heat transfer model.