A Simple Linear Model for the Performance Evaluation of Cascade Fin Arrays

Hsin-I Chou, Jau-Huai Lu
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Abstract

Cascade fin arrays are used widely to enhance heat transfer in electronic packaging. To analyze the performance of a cascade fin array, usually a complex 3D CFD heat transfer model is conducted in industry. It is time consuming and high computing resource is required. A simple linear model is proposed in this paper to analyze the fin array in a quick and accurate way. Three cases were analyzed and the results of this model were compared with that obtained by CFD. It was found the error in temperature prediction is within 1%.
叶栅翅片阵列性能评价的简单线性模型
在电子封装中,叶栅翅片阵列被广泛应用于增强热传递。为了分析叶栅翅片阵列的性能,工业上通常采用复杂的三维CFD传热模型。该方法耗时长,且需要大量的计算资源。本文提出了一种简单的线性模型,可以快速准确地分析鳍阵列。对3个实例进行了分析,并与CFD计算结果进行了比较。结果表明,温度预测误差在1%以内。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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