Simultaneous Multi Voltage Aware Timing Analysis Methodology for SOC using Machine Learning

Vishant Gotra, S. Reddy
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引用次数: 2

Abstract

To improve gross margins, the semiconductor industry is focused on the PPA (power, performance, area) matrix of the SOC. The current trend is to put more IPs on the chips to enable multiple functionalities to support various applications. To optimize PPA of such SOCs, multi voltage and multi power domain design techniques are used due to which the timing signoff of the chip has to be done on multiple corners and multiple modes (MCMM). Single voltage timing analysis is easier. With the multi-level supply voltage and dynamic scaling features, the timing analysis complexity increases because timing signoff has to be done on different voltages and cross-voltage paths. Multi-voltage designs need exhaustive analysis of cross voltage domain paths to make sure all worst-case paths are identified under all voltage combinations. With numerous operating PVT corners, timing analysis across corners is very challenging. Simultaneous multi-voltage aware analysis (SMVA) do the analysis of all cross-domain paths under all voltage scenarios in a single run, without the need for margining that can add pessimism. In this paper, we propose a machine learning model, based on bigrams of path stages, to predict the timing slack divergence and cell delays across voltages. We identified the circuit parameters which affects the cell delays due to voltage changes and thereby causing the differences in the endpoint arrival times. We use the timing analysis data of a given testcase at multiple voltages and with the use of Classification and regression tree (CART) approach we develop a predictive model for the new arrival times due to the change in voltages. Experimental results show that our model is able to predict the timing path slack divergence with ~97% accuracy at different voltages on both clock and data paths with a lower turnaround time including the cross-voltage timing paths.
基于机器学习的SOC同步多电压感知时序分析方法
为了提高毛利率,半导体行业专注于SOC的PPA(功率、性能、面积)矩阵。目前的趋势是在芯片上放置更多的ip,以实现多种功能以支持各种应用。为了优化这种soc的PPA,使用了多电压和多功率域设计技术,因为芯片的时序信号必须在多个角和多个模式(MCMM)上完成。单电压定时分析更容易。由于电源电压具有多电平和动态标度的特点,需要在不同电压和交叉电压路径上进行时序签名,从而增加了时序分析的复杂性。多电压设计需要对交叉电压域路径进行详尽的分析,以确保在所有电压组合下识别出所有最坏情况路径。由于PVT弯道数量众多,因此跨弯道的定时分析非常具有挑战性。同步多电压感知分析(SMVA)可以在一次运行中分析所有电压情况下的所有跨域路径,而不需要进行可能增加悲观情绪的余量。在本文中,我们提出了一个基于路径阶段双图的机器学习模型,以预测电压之间的定时松弛发散和单元延迟。我们确定了由于电压变化而影响电池延迟的电路参数,从而导致端点到达时间的差异。我们使用给定测试用例在多个电压下的时序分析数据,并使用分类和回归树(CART)方法,我们开发了由于电压变化而导致的新到达时间的预测模型。实验结果表明,该模型在包括交叉电压时序路径在内的时钟路径和数据路径上,在不同电压下均能以较低的周转时间预测时序路径松弛散度,准确率达97%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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