Optimization of silver tin oxide chemistry to enhance electrical performance in a.c. application

Electrical Contacts - 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on Electrical Contacts (Cat. No.98CB36238) Pub Date : 1998-10-26 DOI:10.1109/HOLM.1998.722445

H.A. Francisco, M. Myers

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引用次数: 3

Abstract

The addition of copper oxide (0.37-0.53%) to silver tin oxide based material substantially improved the electrical performance in a.c. application. The erosion behavior of the material was directly related to the level of copper oxide in the silver tin oxide based materials. The investigation was undertaken to correlate the changes in contact performance as the copper oxide additive varied. Performance changes and physical characteristics of each material, such as formability (tensile properties), contact resistance and contact material erosion (arc erosion) were evaluated. The resistance to arc erosion of silver tin oxide based material containing 0.37-0.53% copper oxide by weight was superior in comparison to other silver tin oxide based materials containing 0.025%, 0.065% and 0.96% of copper oxide. In addition changes in electrical resistance were not dependent on the chemistry of each material. The results suggested copper oxide addition of 0.37-0.53% by weight was the chief reason silver tin oxide based materials out-performed other doped silver tin oxide based material under the same test conditions.

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优化氧化银锡的化学性质以提高交流应用中的电性能

在氧化银锡基材料中加入氧化铜(0.37 ~ 0.53%)，大大提高了交流应用中的电性能。材料的腐蚀行为与氧化银锡基材料中氧化铜的含量直接相关。研究了氧化铜添加剂对接触性能变化的影响。评估了每种材料的性能变化和物理特性，如成形性(拉伸性能)、接触电阻和接触材料侵蚀(电弧侵蚀)。含0.37 ~ 0.53%氧化铜的氧化银锡基材料的抗电弧侵蚀性能优于含0.025%、0.065%和0.96%氧化铜的氧化银锡基材料。此外，电阻的变化并不取决于每种材料的化学性质。结果表明，在相同的测试条件下，氧化铜添加量为0.37 ~ 0.53%是氧化银锡基材料优于其他掺杂氧化银锡基材料的主要原因。

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Electrical Contacts - 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on Electrical Contacts (Cat. No.98CB36238)

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