{"title":"The next generation of maskless lithography","authors":"S. Diez","doi":"10.1117/12.2211052","DOIUrl":null,"url":null,"abstract":"The essential goal for fast prototyping of microstructures is to reduce the cycle time. Conventional methods up to now consist of creating designs with a CAD software, then fabricating or purchasing a Photomask and finally using a mask aligner to transfer the pattern to the photoresist. The new Maskless Aligner (MLA) enables to expose the pattern directly without fabricating a mask, which results in a significantly shorter prototyping cycle. To achieve this short prototyping cycle, the MLA has been improved in many aspects compared to other direct write lithography solutions: exposure speed, user interface, ease of operation and flexibility.","PeriodicalId":122702,"journal":{"name":"SPIE OPTO","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE OPTO","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2211052","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
The essential goal for fast prototyping of microstructures is to reduce the cycle time. Conventional methods up to now consist of creating designs with a CAD software, then fabricating or purchasing a Photomask and finally using a mask aligner to transfer the pattern to the photoresist. The new Maskless Aligner (MLA) enables to expose the pattern directly without fabricating a mask, which results in a significantly shorter prototyping cycle. To achieve this short prototyping cycle, the MLA has been improved in many aspects compared to other direct write lithography solutions: exposure speed, user interface, ease of operation and flexibility.