4Gbit density STT-MRAM using perpendicular MTJ realized with compact cell structure

Sung-Woong Chung, T. Kishi, Jeongsoo Park, M. Yoshikawa, Kyoung-Hwan Park, T. Nagase, K. Sunouchi, H. Kanaya, G. Kim, K. Noma, Mun-Haeng Lee, A. Yamamoto, KwangMyoung Rho, K. Tsuchida, Suock Chung, J. Yi, Hyeongon Kim, Chun Yun-Seok, H. Oyamatsu, Sung-Kee Hong
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引用次数: 111

Abstract

For the first time, 4Gbit density STT-MRAM using perpendicular MTJ in compact cell was successfully demonstrated through the tight distributions for resistance and magnetic properties. This paper includes the results regarding parasitic resistance control process, MTJ process, and MTJ stack engineering. Both of successful 4Gb read and write operations were performed with high TMR, low Ic. This result will brighten the prospect of high-density STT-MRAM.
4Gbit密度STT-MRAM采用垂直MTJ实现,小区结构紧凑
首次成功地证明了垂直MTJ的4Gbit密度STT-MRAM在紧凑电池中的电阻和磁性能分布紧密。本文包括寄生电阻控制过程、MTJ过程和MTJ堆栈工程方面的研究成果。这两个成功的4Gb读写操作都是在高TMR、低Ic的条件下完成的,这一结果将照亮高密度STT-MRAM的前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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