Effect of Ge content and annealing temperature on resistance properties of Cu-8Mn alloy

Wangbing, Zouhonghui, Mazhixin, Wenjunguo, Lidefu, Guoshengli
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Abstract

The as-cast Cu-8Mn-xGe (x=0, 1.35wt%, 1.7wt%, 2.2wt%) alloys were prepared by horizontal continuous casting process. The annealed alloy samples were obtained by multi-pass drawing and annealing process. The effects of Ge content and annealing temperature on the resistivity and resistance temperature coefficient of the alloys were investigated by means of optical microscope, scanning electron microscope, DC resistance tester and resistance temperature coefficient tester. The results show that the resistivity of Cu-8Mn-xGe alloy increases from 0.26 µΩ•m to 0.36 µΩ•m with the increase of Ge content. The resistivity of Cu-8Mn-1.7Ge alloy decreases with the increase of annealing temperature. In terms of the temperature coefficient of resistance (TCR), the TCR of Cu-8Mn-xGe alloy decreases with the increase of the content of Ge atom, from 21.74 × 10-6 °C-1•to -13.00 × 10-6 °C-1. The TCR of Cu-8Mn-xGe alloy is significantly reduced by Ge element. The TCR of Cu-8Mn-1.7Ge alloy increases with the increase of annealing temperature from 26.90 × 10-6 °C-1 to 118.00 × 10-6 °C-1. In terms of microstructure, the average grain size of Cu-8Mn-1.7Ge alloy increases from 5.68µm to 22.06µm with the increase of heat treatment temperature.
Ge含量和退火温度对Cu-8Mn合金电阻性能的影响
采用水平连铸法制备铸态Cu-8Mn-xGe合金(x=0、1.35wt%、1.7wt%、2.2wt%)。通过多道次拉伸和退火工艺得到退火后的合金样品。采用光学显微镜、扫描电镜、直流电阻测试仪和电阻温度系数测试仪研究了Ge含量和退火温度对合金电阻率和电阻温度系数的影响。结果表明:随着Ge含量的增加,Cu-8Mn-xGe合金的电阻率从0.26µΩ•m增加到0.36µΩ•m;Cu-8Mn-1.7Ge合金的电阻率随退火温度的升高而降低。在电阻温度系数(TCR)方面,Cu-8Mn-xGe合金的TCR随Ge原子含量的增加而降低,由21.74 × 10-6°C-1•降至-13.00 × 10-6°C-1•。Ge元素显著降低了Cu-8Mn-xGe合金的TCR。随着退火温度的升高,Cu-8Mn-1.7Ge合金的TCR由26.90 × 10-6°C-1提高到118.00 × 10-6°C-1。显微组织方面,随着热处理温度的升高,Cu-8Mn-1.7Ge合金的平均晶粒尺寸由5.68µm增大到22.06µm;
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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