Feasibility Study of Nanotwinned Copper and Adhesive Hybrid Bonding for Heterogeneous Integration

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) Pub Date : 2021-06-01 DOI:10.1109/ECTC32696.2021.00081

C. Hsiao, H. Fu, C. Chiang, O. Lee, Tsung-Yu Ou Yang, Hsiang-Hung Chang

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引用次数: 5

Abstract

In this study, the wafer-level nanotwinned copper (nt-Cu) and BCB adhesive hybrid bonding is proposed. The (111) oriented nt-Cu and BCB adhesive are used for electrical interconnection and mechanical enhancement, respectively. Nanotwinned copper direct bonding, BCB adhesive bonding, nt-Cu and BCB adhesive hybrid bonding are investigated. In nt-Cu direct bonding, the highly (111) oriented surface ratio of nt-Cu is 97% by increasing plating current density, the columnar grain size and (111) oriented surface ratio are identified by Focused Ion Beam (FIB) and Electron Back Scatter Diffraction (EBSD). The surface roughness of nt-Cu is reduced to 0.72 nm after Chemical Mechanical Polishing (CMP) and nt-Cu to nt-Cu direct bonding without large bonding voids is achieved at 250 °C for 1 h. In BCB adhesive bonding, BCB to BCB could be well bonded at 250 °C. There are no samples peeling after dicing and the average shear strength is larger than 24 MPa. Currently, the surface topography and bonding result of nt-Cu and BCB hybrid structure are improved after tuning BCB curing and fly cutting condition.

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纳米孪晶铜与胶粘剂杂化键合异质集成的可行性研究

本研究提出了晶圆级纳米孪晶铜(nt-Cu)与BCB胶粘剂的杂化键合。(111)取向的nt-Cu和BCB粘合剂分别用于电气互连和机械增强。研究了纳米孪晶铜直接键合、BCB胶粘剂键合、纳米孪晶铜与BCB胶粘剂的杂化键合。采用聚焦离子束(FIB)和电子背散射衍射(EBSD)对纳米铜直接键合的柱状晶粒尺寸和纳米铜的(111)取向表面比进行了表征。化学机械抛光(CMP)后，nt-Cu的表面粗糙度降至0.72 nm，在250℃下放置1 h，实现了nt-Cu与nt-Cu的直接键合，且没有大的键合空隙。在BCB粘接中，在250℃下可以很好地粘合BCB与BCB。切割后试样无剥落现象，平均抗剪强度大于24 MPa。目前，通过调整BCB固化和飞切条件，改善了nt-Cu和BCB杂化结构的表面形貌和结合效果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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