Advanced yield enhancement: computer-based spatial pattern analysis. Part 1

Abstract

Wafer-level defect distributions and yield patterns are a significant source of information about the performance of a manufacturing line. Computer-based techniques are ideal for pattern analysis because they provide the ability to quickly perform systematic, repetitive analyses on large data sets. The development of algorithms for computer-based spatial pattern analysis are described and initial test results are presented. Integration of automated spatial pattern analysis into the manufacturing process is discussed.