{"title":"Advanced Microfabrication Techniques for Millimetre Band Cavities","authors":"M. Verdiel, J. Protz","doi":"10.1109/IVELEC.2007.4283251","DOIUrl":null,"url":null,"abstract":"microfabrication recipe involving Deep Reactive Ion Etching, Chemical Mechanical Polishing, and Silicon Direct Bonding is proposed as a way to fabricate high precision cavities for millimetre band devices. The effect of fabrication variances on device performance is predicted.","PeriodicalId":254940,"journal":{"name":"2007 IEEE International Vacuum Electronics Conference","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Vacuum Electronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IVELEC.2007.4283251","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
microfabrication recipe involving Deep Reactive Ion Etching, Chemical Mechanical Polishing, and Silicon Direct Bonding is proposed as a way to fabricate high precision cavities for millimetre band devices. The effect of fabrication variances on device performance is predicted.