The study of polyimide films and adhesion using a surface acoustic wave sensor

Abstract

A dual delay line surface acoustic wave (SAW) sensor on an ST-quartz substrate has been used to study water uptake and downtake and its effect on adhesion in both cured and uncured polyimide films. Particular attention is focused on the effect that an adhesion promoter may have on the strength of the adhesive bond. Film samples both with and without an adhesion promoter were studied. The experimental results suggest the possibility of using a SAW sensor as a cure indicator, humidity sensor, or adhesion sensor.<>