The study of TIM polymer composite materials thermal conductivity

Abstract

A recent trend in electronic technology deals with a sharp performance increase within decrease dimensions and mass of devices. High-performance thermal interface materials (TIM) primarily thermal pastes are indispensable to application. A number of filler materials: ceramics (aluminum nitride, silicon carbide, alumina) metals (aluminum, copper) and graphite were considered to apply. The data containing average particles size, specific surface area, and maximal volume and mass fraction for various materials was obtained. The thermal conductivity of samples with aluminum and graphite dramatically exceed values obtained within mathematical models’ calculation. The highest thermal conductivity values were obtained for SiC (1.37 W/(m·K)), AlN (1.09 W/(m·K)), C (2.85 W/(m·K)) and Al (1.20 W/(m·K)), that mad the mentioned above materials the most promising for high-performance thermal pastes.