A finite width impurity source model for linear doping profiles

Tommy M. L. Lai, J. Sin, P. Ko
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Abstract

In order to provide high breakdown voltage in thin-film SOI devices, a linear doping profile in the drift region is needed. The linear doping profile can be obtained by using a lateral variation doping technique. In this technique, a smeared-out dopant distribution is implemented through the use of a sequence of small opening slits in the oxide with subsequent impurity implantation and drive-in processes. In this paper, an analytical model is presented to describe the impurity distribution of a finite width impurity source which is used to form the linear doping profile. This model provides a basis for determination of the slits width and silts spacing which are required to implement the linear doping profile.
线性掺杂谱线的有限宽度杂质源模型
为了在薄膜SOI器件中提供高击穿电压,需要在漂移区采用线性掺杂。通过使用横向变化掺杂技术可以获得线性掺杂轮廓。在该技术中,通过在氧化物中使用一系列小的开口狭缝,以及随后的杂质注入和驱动过程来实现涂抹出的掺杂剂分布。本文提出了一种描述用于形成线性掺杂谱线的有限宽度杂质源的杂质分布的解析模型。该模型为确定实现线性掺杂剖面所需的狭缝宽度和泥沙间距提供了依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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