Mutual coupling reduction using metamaterial supersubstrate for high performance & densely packed planar phased arrays

M. Alibakhshikenari, A. Salvucci, G. Polli, B. Virdee, C. See, R. Abd‐Alhameed, F. Falcone, A. Andújar, J. Anguera, E. Limiti
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引用次数: 13

Abstract

This paper proposes on an effective mutual coupling suppression technique for planar phased array. This is achieved locating a metamaterial superstrate patch between radiation elements of phased array. The superstrate patch is realised by incorporating slots inside the patch, where the slots are arranged in 2×3 array column. The proposed mutual radiation decoupling technique is implemented on FR-4 substrate. Average coupling suppression of 5 dB is achieved on a low permittivity substrate over its operational frequency band. The proposed technique is (i) simple to implement; (ii) planar design; (iii) easily realised in practice; (iv) overcomes the shortcomings of poor front-to-back ratio previously reported in other radiation suppression techniques; and (v) applicable for densely packed microstrip. Furthermore, the proposed planar technique is highly versatile for various applications having stringent performance requirements.
利用超材料基板减少互耦,实现高性能高密度平面相控阵
提出了一种有效的平面相控阵相互耦合抑制技术。这实现了在相控阵辐射单元之间定位超材料层片。superstrata patch是通过在patch内部合并插槽来实现的,其中插槽排列在2×3数组列中。所提出的互辐射去耦技术在FR-4衬底上实现。在低介电常数衬底上,在其工作频带内实现了5 dB的平均耦合抑制。所建议的技术(i)易于实现;(ii)平面设计;(三)在实践中容易实现;(iv)克服以往其他辐射抑制技术所报告的前后比较差的缺点;(5)适用于密实微带。此外,所提出的平面技术对于具有严格性能要求的各种应用具有高度通用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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