{"title":"Sidewall Imaging of Microstructures with a Tilted Quartz Tuning Fork (QTF) Force Sensor","authors":"Danish Hussain, Wen Yongbing, Hui Xie","doi":"10.1109/MARSS.2018.8481199","DOIUrl":null,"url":null,"abstract":"Sidewall imaging of micro and nano structures is essential for critical dimensional metrology in the semiconductor industry. Atomic force microscope is an important sidewall imaging instrument due to its three dimensional imaging capability, high accuracy and ultra high resolution. We propose an AFM method for sidewall imaging of high step sidewalls. A tuning fork force sensor with a tungsten tip is tilted at a suitable angle (θ) to access the sidewall. Sidewalls of a micro electromechanical systems (MEME) structure fabricated by deep reactive ion etching (DIRE) process is scanned and sidewall roughness is measured.","PeriodicalId":118389,"journal":{"name":"2018 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS)","volume":"264 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MARSS.2018.8481199","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Sidewall imaging of micro and nano structures is essential for critical dimensional metrology in the semiconductor industry. Atomic force microscope is an important sidewall imaging instrument due to its three dimensional imaging capability, high accuracy and ultra high resolution. We propose an AFM method for sidewall imaging of high step sidewalls. A tuning fork force sensor with a tungsten tip is tilted at a suitable angle (θ) to access the sidewall. Sidewalls of a micro electromechanical systems (MEME) structure fabricated by deep reactive ion etching (DIRE) process is scanned and sidewall roughness is measured.
微纳米结构的侧壁成像在半导体工业的关键尺寸测量中是必不可少的。原子力显微镜具有三维成像能力、高精度和超高分辨率,是一种重要的侧壁成像仪器。提出了一种用于高台阶侧壁成像的原子力显微镜方法。带钨尖的音叉力传感器以合适的角度(θ)倾斜以接触侧壁。对采用深度反应离子蚀刻(deep reactive ion etching, DIRE)工艺制备的微机电系统(MEME)结构的侧壁进行了扫描,并测量了侧壁粗糙度。