{"title":"Bloch surface waves, a 2D platform for planar optical integration","authors":"H. Herzig, E. Barakat, L. Yu, R. Dubey","doi":"10.1109/WIO.2014.6933280","DOIUrl":null,"url":null,"abstract":"A novel platform suitable for fundamental investigations of light propagation through micro- and nano-structures will be discussed. This platform is based on a dielectric multilayer that sustains Bloch surface waves (BSWs). BSWs are electromagnetic surface waves excited at the interface between a truncated periodic dielectric multilayer and a surrounding media. The modification of the top surface to customize a complete 2D micro-system can be produced using e-beam writing, optical lithography or other patterning techniques. The results obtained confirm the possibility of developing a robust multilayer platform that would pave the way for integration of photonic components in photonic chips using standard wafer-scale production.","PeriodicalId":183646,"journal":{"name":"2014 13th Workshop on Information Optics (WIO)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 13th Workshop on Information Optics (WIO)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WIO.2014.6933280","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
A novel platform suitable for fundamental investigations of light propagation through micro- and nano-structures will be discussed. This platform is based on a dielectric multilayer that sustains Bloch surface waves (BSWs). BSWs are electromagnetic surface waves excited at the interface between a truncated periodic dielectric multilayer and a surrounding media. The modification of the top surface to customize a complete 2D micro-system can be produced using e-beam writing, optical lithography or other patterning techniques. The results obtained confirm the possibility of developing a robust multilayer platform that would pave the way for integration of photonic components in photonic chips using standard wafer-scale production.